OKI Unveils Space-Grade Rigid-Flex PCBs with Embedded Copper Coins for Superior Heat Dissipation

OKI Circuit Technology (OTC), the OKI Group's PCB business company, has developed rigid-flex PCBs with embedded copper coins designed to deliver superior heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments. The innovative design eliminates the need for connectors to link boards, enabling space savings, weight reductions, and fewer mounting man-hours—critical advantages for space applications where every gram and cubic centimeter count.

The challenge of heat dissipation in vacuum environments is particularly acute, as no convective heat transfer occurs. The embedded copper coins in OKI's PCBs efficiently transfer heat away from high-performance components, ensuring reliable operation even in extreme conditions. OTC can flexibly accommodate small-lot production to meet varying specification requirements based on shape, size, and mounting location, making the technology suitable for stages from development and prototyping to mass production.

Beyond product development, OKI leverages its space-quality manufacturing capabilities in design, production, and simulations at the equipment design phase to support customers. The company is targeting annual sales of 20 million yen for these space-grade PCBs in FY2026, with sales set to begin in August 2025. To showcase its innovation, OTC will exhibit at the Japan Booth of the Small Satellite Conference held from August 10 to 13, 2025, at the Salt Palace Convention Center in Utah, USA.

With the growing demand for small satellites and deep-space exploration, OKI's new rigid-flex PCBs address a critical market need and position the company as a key player in the global aerospace electronics supply chain.